A 3D Printed, Self-Insulated, High-Throughput 3D Microelectrode Array

Technology #11591

Key Points

  • Makerspace-based microfabrication strategy for developing high-throughput (HT), self-insulated 3D microelectrode arrays (MEAs)
  • Unique bifacial design enables hassle-free integration with commercial amplification systems, as no through-vias are required to transition the traces to the bottom face
  • Offers the advantage of monolithically printing the entire device geometry according to ANSI/SLAS standards, and a simple silver ink-casting technique realizes the electrical connections and the 3D MEAs

Abstract

The University of Central Florida invention is a novel two-step, makerspace-based microfabrication strategy for creating high-throughput (HT), self-insulated 3D microelectrode arrays (MEAs). Microstereolithography (μSLA)-based 3D printing technology not only allows for the realization of 3D microelectrode geometries but also enables the monolithic integration of all components of the “bio plate” (standard culture wells) to realize the HT, American National Standards Institute (ANSI)/Society for Lab Automation and Screening (SLAS)-compatible geometry in 1 to 768 well (or more wells) configurations. This approach enables a rapid, accurate, cost-effective, two-step scaling up technique to microfabricate HT-3D microelectrode arrays in several multiwell designs compatible with standard HT assay equipment such as plate readers, robotic handlers, and electrophysiological systems.